Unit/PCB Thermal Analysis


Ingenium has extensive experience analyzing electronic boxes and Printed Circuit Boards (PCBs) for ground and space-based applications. We are highly efficient and can turn around an average complexity PCB in about two days.

Our support includes:

  • Importing data through Intermediate Data Format (IDF) files (e.g. STEP, Parasolid, etc.) and/or Gerber files.
  • Adding component thermal properties and environmental boundary conditions.
  • Incorporating forced or free convective cooling (if necessary)
  • Detection and design mitigation of hot spots
  • Heat sink design
  • Chassis design
  • Detailed reports with power dissipation, junction and case temperatures as well as board and component temperature gradient
  • Environmental testing

Contact Us For A Quote