Ingenium has extensive experience analyzing electronic boxes and Printed Circuit Boards (PCBs) for ground and space-based applications. We are highly efficient and can turn around an average complexity PCB in about two days.
Our support includes:
Importing data through Intermediate Data Format (IDF) files (e.g. STEP, Parasolid, etc.) and/or Gerber files.
Adding component thermal properties and environmental boundary conditions.
Incorporating forced or free convective cooling (if necessary)
Detection and design mitigation of hot spots
Heat sink design
Detailed reports with power dissipation, junction and case temperatures as well as board and component temperature gradient